Gaoce Technology_Cutting equipment,Cutting consumables

Photovoltaic Cutting Solutions

Full Coverage of Core Processes in Silicon Wafer Manufacturing

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Gaoce Inc.

To Become a World Leading Equipment & Service Provider for Hard Brittle Materials Cutting

Qingdao Gaoce Technology Co., Ltd. was established in October 2006. On August 7, 2020, it was listed on the A-share of Science and Technology Innovation Board (stock code: 688556). The headquarters of Gaoce Company is located in the High-tech Industrial Development Zone of Qingdao China with following wholly-owned subsidiaries, Changzhi Gaoce New Material Technology Co., Ltd., Huguan Gaoce New Material Technology Co., Ltd., Luoyang Gaoce Precision Machinery Co., Ltd., Leshan Gaoce New Energy Technology Co., Ltd., Yancheng Gaoce New Energy Technology Co., Ltd., and Yibin Gaoce New Energy Technology Co., Ltd.

2006 Established

Gaoce Company was established in October 2006.

4.474 billion yuan

Operating revenue of 4.474 billion yuan (data as of December 31, 2024)

Industry Solutions

Our Products

Single crystal squaring machine

Single-wire Semiconductor Cutting Machine

Single crystal cutting machine

Semiconductor Chamfering Machine

Crystal Silicon Diamond Wire Saw

GC-800XC Diamond Wire Crystal Silicon Slicer

GC-MK202R

Single crystal squaring machine

This product is used in the squaring process of silicon wafer manufacturing and was launched in 2022. It adopts a circular wire double-station independent processing method, resulting in small range differences and 10% lower silicon loss compared to diamond wire products; there is no chipping, the edges are complete and undamaged, and automatic transportation is possible. When processing G12 products, there are no ridges; it can be switched with one click to process M10, G12, and rectangular bars; it is easy to operate and maintain, making it easy for new users to quickly master the equipment application; it can also be optionally equipped to process semi-bars, with strong scalability.

GC-SEWS824

Single-wire Semiconductor Cutting Machine

This is a special processing equipment for cutting semiconductor monocrystalline silicon rod. The diameter of silicon rod that can be processed is 8-24 inches, and the maximum processing length is 2600mm. The equipment adopts diamond wire cutting, which can realize the functions of cropping, head/tail removal and sample cutting, etc. with the features of high cutting efficiency and good section quality.

GC-MJ706R/908R

Single crystal cutting machine

This product is used in the cutting process of silicon rod manufacturing. Launched in 2022, it boasts high production capacity, small bevel, minimal chipping, and direct AGV material loading without the need for gantry robots. Optional features include direct AGV material loading, automatic rotation, automatic tool alignment, and automatic head/tail material removal, reducing manual labor.

GC-BD804

Semiconductor Chamfering Machine

This product is suitable for edge chamfering processing equipment for semiconductor silicon wafer materials. The equipment is compatible with 4-inch, 6-inch, and 8-inch sizes and has OF-surface processing capabilities. A NOTCH groove processing function is optional. The equipment features high processing precision, high processing efficiency, and stable operation.

GC-800XP

Crystal Silicon Diamond Wire Saw

With the world's first single machine dual station and adjustable wheelbase design, this equipment is playing a significant role in the slicing process of silicon wafer manufacturing. It is compatible with the cutting needs of different sizes of silicon wafers such as16X/18X/210/220/230/240, as well as the development needs of new batteries such as HJT and TOPCon for large-sized, thinned, half wafers, and rectangular wafers. Equipped with eccentric sleeve/eccentric bearing box technology, latest cutting layout, one-piece casting frame and more reliable components, this equipment can achieve a higher stability. It adopts independently developed software and tension control algorithms, reserves MES/automation interfaces, and integrates big data platform to realize intelligent production operations and fine production control. Compared to single station equipment, the footprint per GW can be reduced by 25+%, and labor cost of principal oper- ators by 30+%, which will continuously create value for clients.

GC-800XC

GC-800XC Diamond Wire Crystal Silicon Slicer

This product is used in the slicing stage of silicon wafer manufacturing and was launched in November 2024. Featuring an industry-leading adjustable small wheelbase design, it can accommodate the cutting requirements for silicon wafers of different sizes, including 16X/18X/210/220/230 mm, while simultaneously meeting the development needs of new-generation batteries such as HJT and TOPCon for large sizes, thin slicing, half-cells, and rectangular wafers. It adopts a new cutting area layout with a maximum silicon ingot loading capacity of 950 mm. Using the latest cutting configuration, it enables cutting in multi-gear wheelbase modes spanning 315mm‒370mm (for 182mm products)‒400mm (for 210mm products)‒455mm at a wire speed of 2600 meters per minute. The application of lightweight high-precision wiring system realizes smaller tension fluctuation, the added tension of the whole machine is less than 1N, the comprehensive broken line rate is less than 5%, it has a variety of industry original functions, the stability of the whole machine is stronger, and the cutting efficiency is higher; it is more adaptable to fine wire and thin film, and can meet the stable cutting of wire diameter of 18 microns and below. The comprehensive energy consumption is low, leading the industry. At the same time, it reserves a variety of automation interfaces, which can realize intelligent production operations and fine production control by using big data platform.

Driven by Science and Technology

1032 valid patents

59 software copyrights

Data by Dec. 31, 2024

Photovoltaic Equipment

01.

Photovoltaic monocrystal half-chip production line

It is the first cutting production line for half-chips, where, multiple processes have been adopted to achieve large-scale production of half-chips, including squaring, middle splitting, half-rod grinding, and half-chip cutting; it is the leading half-chips cutting technology in the industry.

Squarer Machine

02.

Double-station loop-wire squaring technology

It is the first double-brick vertical loop-wire squaring equipment, where, the non-destructive structure for wings collection is for the first time developed and applied, and the processing of half-brick as well as the rectangular brick can be compatible.

Grinding and Polishing Machine

03.

Composite grinding spindle technology

For the first time the coarse & fine grinding at same station is developed, which can reduce the fine grinding allowance, improve the machining accuracy and efficiency, and increase the service life of grinding wheel.

Slicing Machine

04.

Adjustable wheelbase technology

Solve the compatibility problem in cutting mainstream silicon wafers of different sizes in the market; Minimize the distance between silicon rod and cutting point of diamond wire on main roller, and improve the cutting efficiency and wafer quality; It is suitable for half-piece cutting with ultra-small wheelbase, and provides technical support for the rapid development of new batteries.

Diamond Wire

05.

12-wire production equipment for electroplated diamond wires

Gaoce is the first company to develop 12-wire diamond wire production equipment.

Diamond Wire

06.

Sandblasting technology for electroplated diamond wires

Fast sandblasting on core steel wire, good sand fixing performance.

Diamond Wire

07.

Iteration technology for thinning of electroplated diamond wires

34μm electroplated diamond wires have been supplied in bulk, the electroplated diamond wire of less than 28μm is in R&D process continuously, and the thinning iteration technology is in the front of the industry.

Semiconductor Slicing Machine

08.

Ultra-precision processing technology for the third-generation semiconductor monocrystal silicon carbide and large size monocrystal silicon

Semiconductor slicing machine: accelerate the substitution of domestic slicing equipment, continue the fine wire cutting, reduce cost, improve efficiency, decrease pollution, improve environmental protection, and guide the technological revolution in the industry.

Globalization

500 +

500 R&D staff

7 manufacturing bases

150 +

150+ sales and after-sales staff

Our Customers

Photovoltaic Semiconductors Silicon Carbide Magnetic Materials Sapphire

News Center

2022/12/29

The publicity film of Gaobeta Joint Stock Company was launched at the end of the year!

2022/12/27

Continuous steady growth, net profit expected to increase by 370%!

On December 26, Gaoshi Shares released the Voluntary Disclosure Announcement on the Anticipated Increase of Annual Performance in 2022. The company expects to realize a net profit attributable to the owners of the parent company of 760 million yuan to 820 million yuan in 2022, which is expected to increase by 587307900 yuan to 647307900 yuan, 340.09% to 374.83% year on year, compared with the same period last year (statutory disclosure data).

2022/12/26

Chen Kundi, the watcher: Be cautious as always with his deeds and words

This is the first time that the Guardian has connected across the ocean. Chen Kundi, the customer service person of Gaosu, is at the customer's site in Vietnam to calibrate the wire spacing of the slicer. In order not to delay the production of the production line, after finishing the work at hand, he came to the canteen for this interview.