GC-LD804

Sapphire Chamfering Machine

Category:

Sapphire Cutting

General description:

This product is suitable for edge chamfering equipment of sapphire chip materials. The equipment is compatible with sizes such as 4 inches, 6 inches, and 8 inches, and has OF surface processing function. It can also be equipped with NOTCH groove processing function. The equipment has high processing accuracy, high processing efficiency, and stable operation.

Product Message

Product Parameter

Item	Parameter
Host size and weight	2,250 (L)1,650 (W)2,600 (H) ㎜; 3,000 kg
Wafer size	468 in
Wafer thickness	300 μm~1,500 μm
Workstation	Dual workstation
Wafer reference surface shape	OF/Notch (Notch optional)
Equipment size	2,250 (W)1,650 (D)2,600 (H)
Grinding X/Y/Z axis accuracy	X/Y/Z axis accuracy: ±1 μm
	Ceramic suction cup plane accuracy: ≤3 μm
	Accuracy of the grinding bench spindle end face and radial direction: ±1 μm
	Accuracy of the grinding wheel spindle end face and radial direction: ±1 μm
Outer diameter of the grinding wheel	Φ202 mm
Inner diameter of the grinding wheel mounting	Φ30 mm
Grinding wheel thickness	20 mm
Rotation speed of the grinding wheel	0-4,000 r/min (according to customer's demands)
Rotation speed of the Notch grinding wheel	0-100,000 r/min (according to customer's demands)
Grinding wheel mode	T, R, TT, RR, TR type, etc.
Wafer thickness measurement (Non-contact or contact type)	Accuracy of the repeated thickness measurement: ±2 μm;
Wafer thickness measurement (Non-contact or contact type)	Measurement number: One point in the center
Cleaning method	Rotation cleaning
Drying method	Centrifugal drying
Loading/unloading section	Number of boxes: 4
Loading/unloading section	Number of slots: 25 (adjustable)