PRODUCT SHOW


Click to browse the large picture
Click to browse the large picture
Click to browse the large picture
Click to browse the large picture
Click to browse the large picture
+
  • GC-SEWS824半导体单线截断机.jpg
  • 背面(7).jpg
  • DSC03606.jpg
  • 正面(11).jpg
  • 左面(9).jpg

GC-SEWS824

Single-wire Semiconductor Cutting Machine


Category:

Semiconductor Cutting Equipment

General description:

This is a special processing equipment for cutting semiconductor monocrystalline silicon rod. The diameter of silicon rod that can be processed is 8-24 inches, and the maximum processing length is 2600mm. The equipment adopts diamond wire cutting, which can realize the functions of cropping, head/tail removal and sample cutting, etc. with the features of high cutting efficiency and good section quality.

Product Parameter

Relevant Products

GC-SEDW812

Semiconductor Diamond-Cutting-Line Slicer

GC-SEDW812A

Semiconductor Diamond Wire Slicing Machine

GC-SELA812

Semiconductor Silicon Wafer Double-sides Grinding Machine

Special Diamond Wire for Semiconductor

Product Message