GC-SEWS824

Single-wire Semiconductor Cutting Machine

Category:

Semiconductor Cutting Equipment

General description:

This is a special processing equipment for cutting semiconductor monocrystalline silicon rod. The diameter of silicon rod that can be processed is 8-24 inches, and the maximum processing length is 2600mm. The equipment adopts diamond wire cutting, which can realize the functions of cropping, head/tail removal and sample cutting, etc. with the features of high cutting efficiency and good section quality.

Product Message

Product Parameter

1.Mechanical Part
Equipment Size	Approx. 5000mm×2560mm×2740mm (L x W x H)
Equipment Weight	Approx. 5500kg
2.Size of Silicon Rod
Length of Silicon Rod	300~2000mm (excluding head and tail, cutting from head to tail without reversing)
Diameter of Silicon Rod	Φ200～Φ600mm
Processing Quantity	1 piece/block
Segment Length	150mm~400mm (manual cutting is required when less than 300mm)
Number of Cutting Point	1
Sample Thickness	2～15mm
3. Cutting Part
Feeding Drive	Servo motor, lifting up/down of lead screw
Moving Speed of Cutting Head	0～900mm/min, stepless adjustable
Cutting Feed Speed	0～20mm/min(the actual cutting process shall be set according to the diameter of silicon rod)
Diameter of Cutting Wire	Φ0.42mm
Cutting Time	Average ≤90 minutes, complete the cutting for 18-inch silicon rod with one operation (the time may be adjusted according to the cutting quality)
4.Cutting Tension
Tension of Cutting Wire	0～120N
5.Equipment System
Mains Power Supply	380Ｖ±10％AC, 50Hz±1Hz
Power Load	14KVA