GC-800XC

GC-800XC Crystal Silicon Diamond Wire Saw

Category:

Photovoltaic Cutting Equipment

General description:

This product is designed for the slicing process during wafer manufacturing and has launched in November 2024. It adopts new platform and industry-leading adjustable small wheelbase design, which can meet the cutting needs of various sizes of wafers such as 16X/18X/210/220/230/. It is also compatible with the development needs of large-sized, thin slice, half slice, and rectangular slice of new batteries such as HJT and TOPCon.
The product adopts a brand - new cutting area layout, with a maximum silicon rod loading capacity of 950mm. It uses the latest cutting layout, enabling multi - gear wheelbase mode cutting at a wire speed of 2400m/min, covering 280mm - 350mm (for 182 products) - 380mm (for 210 products) - 400mm, and at a wire speed of 2600m/min, covering 280mm - 360mm (for 182 products) - 390mm (for 210 products) - 400mm.
It applies a light weight high precision wire running system, achieving smaller tension fluctuations and lower additional tension of the whole machine. The product features multiple industry first functions, ensuring stronger overall machine stability and higher cutting efficiency. It has better adaptability to thinner wires and thinner wafers, and is more convenient to operate. At the same time, it reserves multiple automation interfaces, and can utilize the big data platform to realize intelligent production operations and refined production control.

Product Message

Product Parameter

Parameter
Size of silicon rod	□166~□230xLMax.950mm(compatible with half wafer)
Wheelbase	315~455mm
Wire reserve	240km
Cutting speed	2600m/min
Equipment Size	Approx. 5110x2481x3275mm
Equipment Weight	Approx.15500kg