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Silicon Carbide Wafering Machine


Silicon Carbide Cutting Equipment

General description:

This product is a special processing equipment that adopts the diamond wire for cutting semiconductor silicon carbide wafers, it can process crystal rod of various diameters, compatible with 6 inches and 8 inches, and the maximum processing length is 300mm. It has following features, small material loss, good processing quality, high cutting efficiency, good stability, etc.

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