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GC-SCDW8300
Silicon Carbide Wafering Machine
Category:
Silicon Carbide Cutting Equipment
General description:
Product Parameter
S.N. | Project | Unit | Content |
1 |
Max workpiece size |
mm |
6~8”×L300 |
2 |
Incoming direction |
|
One-way incoming/two-way incoming |
3 |
Max linear speed |
m/min |
3000 |
4 |
Cutting method |
|
Downwards cutting |
5 |
Cutting speed |
mm/min |
|
6 |
Fast forward/rewind |
mm/min |
50~500 |
7 |
Max. swing angle |
° |
±10 |
8 |
Max. wire reserve |
Km |
120 |
9 |
Equipment size (L*W*H) |
mm |
About 4880×2100×3100 |
10 |
Equipment Weight |
Kg |
About 14000 |
Key word: Photovoltaic | Semiconductor | Silicon Carbide | Sapphire | Magnetic Materials | Silicon Wafer Cutting Service
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Product Message
Qingdao Gaoce Technology Co., Ltd.

Tel: 86-532-87903188

Address: No. 66, Chongsheng Road, High Tech Industrial Development Zone, Qingdao, Shandong, China, 266114
Copyright © 2023 Qingdao Gaoce Technology Co., Ltd. SEO
Qingdao Gaoce Technology Co., Ltd.

Tel: 86-532-87903188

Address: No. 66, Chongsheng Road, High Tech Industrial Development Zone, Qingdao, Shandong, China, 266114
Copyright © 2022 Gaoce Technology SEO