PRODUCT SHOW


Click to browse the large picture
+
  • 碳化硅八寸切片机GC-SCDW8300.jpg

GC-SCDW8300

Silicon Carbide Wafering Machine


Category:

Silicon Carbide Cutting Equipment

General description:

This product is a specialized multi wire cutting equipment for diamond wire cutting silicon carbide crystal bars, with adjustable wheelbase, workpiece swing, low cutting material loss, and low cutting line consumption; Combined with specialized diamond wire, high-precision tension control system, and high-speed cutting technology, achieve stable cutting of 6-8 inch crystals with high efficiency and quality.

Product Parameter

Relevant Products

undefined

undefined

Contact Us

Contact Us


*Note: be sure the information is filled accurately and the communication is clear, and we will get in touch with you as soon as possible