GC-SCDW8300

Silicon Carbide Wafering Machine

Category:

Silicon Carbide Cutting Equipment

General description:

This product is a specialized multi wire cutting equipment for diamond wire cutting silicon carbide crystal bars, with adjustable wheelbase, workpiece swing, low cutting material loss, and low cutting line consumption; Combined with specialized diamond wire, high-precision tension control system, and high-speed cutting technology, achieve stable cutting of 6-8 inch crystals with high efficiency and quality.

Product Message

Product Parameter

S.N.	Project	Unit	Content
1	Max workpiece size	mm	6～8”×L300
2	Incoming direction	/	One-way feeding/two-way feeding
3	Max linear speed	m/min	3000
4	Cutting method	/	Downwards cutting
5	Fast forward/rewind	mm/min	50～500
6	Max. swing angle	°	±10
7	Max. wire reserve	Km	100
8	Equipment size (LWH)	mm	About 4880×2100×3100
9	Equipment Weight	Kg	About 14000