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GC-MK202R

Single crystal squaring machine


Category:

Photovoltaic Cutting Equipment

General description:

This product is used in the squaring process of silicon wafer manufacturing and was launched in 2022. It adopts a circular wire double-station independent processing method, resulting in small range differences and 10% lower silicon loss compared to diamond wire products; there is no chipping, the edges are complete and undamaged, and automatic transportation is possible. When processing G12 products, there are no ridges; it can be switched with one click to process M10, G12, and rectangular bars; it is easy to operate and maintain, making it easy for new users to quickly master the equipment application; it can also be optionally equipped to process semi-bars, with strong scalability.

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