Silicon Carbide Cutting Solutions

Solution Profile

Gaoce is the world’s largest professional silicon wafer processing service provider with the most comprehensive compatible specifications. By leveraging its technical closed-loop advantage in “cutting equipment, consumables, and processes,” the company offers silicon wafer cutting services and multi-specification wafers globally. Currently, its total planned capacity is 102GW, with 63GW operational across production bases in Yibin and Leshan (Sichuan Province) and Yancheng (Jiangsu Province). In 2024, the shipment volume of silicon wafers for silicon wafer slicing services was 37.5GW.
Gaoce continues to enhance its intelligent manufacturing capabilities by integrating cutting-edge technologies such as industrial internet, big data, digital twin, and generative AI with wafer manufacturing scenarios. This approach enables the creation of technologically advanced, highly automated, and cost-efficient production bases, combining technical leadership with cost advantages to help global silicon wafer enterprises reduce costs and improve efficiency.

Related Products