Electroplated diamond wire

Category:

Photovoltaic Cutting Consumables

General description:

Diamond wire, also known as diamond cutting wire or simply diamond wire, is a linear cutting tool formed by bonding diamond abrasives to a steel wire substrate using a binder. Depending on the type of binder and manufacturing method, it is classified into resin diamond wire and electroplated diamond wire. Electroplated diamond wire is a cutting wire formed by electroplating nickel to bond diamonds to a steel wire substrate.
Electroplated diamond wire is mainly used in the hard and brittle material cutting industry, including the cutting, squaring, and slicing of monocrystalline silicon and polycrystalline silicon in the photovoltaic field; the cutting and slicing of semiconductor materials; and the cutting of non-metallic hard and brittle materials such as sapphire, special glass, and ceramics in the LED field, and the cutting of neodymium iron boron and ferrite in the magnetic material field.
Based on in-depth market insights and a relatively complete R&D system, Gaoces Co., Ltd. gives full play to the synergistic R&D and technological closed-loop advantages of "equipment + process + consumables" cutting, continuously promoting the improvement of diamond wire manufacturing technology and product performance.
Thin wire development: The company has always been a leader in the industry, promoting the iterative R&D and testing of tungsten wire and carbon wire thinning, continuously reducing cutting costs;
Product performance: Through continuous process optimization and equipment upgrades, products of various specifications have good cutting capabilities, significantly improved uniformity of micropowder distribution and blade consistency, ensuring that customers can control wire usage in cutting, wire breakage, surface quality, and slice thickness uniformity;
Cost competitiveness: The company is always committed to driving down costs through technological innovation, helping the industry reduce costs and increase efficiency.

Product Message

Product Parameter

Product Specifications	Wire Diameter/um	Yield	Breaking Strength/N	Product Use
20 Tungsten Wire Electroplated Diamond Wire	38±2	120±60	≥4.0	Single Crystal Silicon Cutting
22 Tungsten Wire Electroplated Diamond Wire	40±2	120±60	≥4.3	Single Crystal Silicon Cutting
24 Tungsten Wire Electroplated Diamond Wire	42±2	120±60	≥4.8	Single Crystal Silicon Cutting
26 Tungsten Wire Electroplated Diamond Wire	44±2	120±60	≥5.4	Single Crystal Silicon Cutting
28 Tungsten Wire Electroplated Diamond Wire	46±2	120±60	≥6.0	Single Crystal Silicon Cutting
26 Carbon Wire Electroplated Diamond Wire	43±2	120±60	≥4.3	Single Crystal Silicon Cutting
28 Carbon Wire Electroplated Diamond Wire	45±2	120±60	≥4.9	Single Crystal Silicon Cutting
30 Carbon Wire Electroplated Diamond Wire	47±2	120±60	≥5.5	Single Crystal Silicon Cutting
32 Carbon Wire Electroplated Diamond Wire	49±2	120±60	≥5.8	Single Crystal Silicon Cutting
34 Carbon Wire Electroplated Diamond Wire	51±2	120±60	≥6.0	Single Crystal Silicon Cutting
36 Carbon Wire Electroplated Diamond Wire	53±2	120±60	≥6.5	Single Crystal Silicon Cutting
0.30 Electroplated Diamond Wire	305±20	50±10	≥145	Silicon Crystal Cutting
0.35 Electroplated Diamond Wire	345±20	50±10	≥160	Silicon Crystal Cutting
0.40 Electroplated Diamond Wire	390±20	70±10	≥230	Silicon Crystal Cutting
0.42 Electroplated Diamond Wire	450±20	70±10	≥270	Silicon Crystal Cutting