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Solution
Contact UsOur main business: R&D, production, sales, and supporting services for high hard brittle material cutting equipment, and cutting consumables. -
Product ShowContact UsOur main business: R&D, production, sales, and supporting services for high hard brittle material cutting equipment, and cutting consumables.
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News
Contact UsOur main business: R&D, production, sales, and supporting services for high hard brittle material cutting equipment, and cutting consumables. -
About Us
Contact UsOur main business: R&D, production, sales, and supporting services for high hard brittle material cutting equipment, and cutting consumables. -
Contact UsOur main business: R&D, production, sales, and supporting services for high hard brittle material cutting equipment, and cutting consumables.
SOLUTION
Silicon Wafer Cutting Service
Solution Profile
Solution Profile
To reduce slicing cost and improve slicing efficiency & quality, in February 2021, we established a photovoltaic large silicon wafer R&D center and intelligent manufacturing demonstration base in Leshan, Sichuan, focusing on the R&D and large-scale production of large size fine-wire silicon wafer cutting, and providing large-scale solutions in cutting of large silicon wafers for the industry. Gaoce company is the only enterprise fully covering the cutting equipment, cutting consumables, and wafer cutting services in the photovoltaic industry; the production capacity of slices being built and to be built is 102GW in total; now, 26GW capacity has been built; we can provide services for 210/182/210R silicon wafers of different thickness 155μm, 150μm, 145μm and 130μm; all of them can assist the enterprises in reducing cost and increasing efficiency, and promoting the comprehensive upgrading of photovoltaic silicon wafer industry in China.
Technology & Innovation
We mainly engage in large size silicon wafer and slicing, and implements the large-scale production for N-type 210 half-slice of 120μm. On Aug. 25, 2022, ultra-thin slice of 80μm was launched first in the industry. On May 12, 2023, the industry premiered 60 μM ultra-thin film.
Slicing Production Capacity
● Photovoltaic large silicon wafer R&D center and intelligent manufacturing demonstration base project have been completed.
● Leshan 20GW photovoltaic large silicon wafers and supporting projects (phase-I 6GW) has been completed.
● Jianhu (phase-I) 10GW photovoltaic large silicon wafer project has been completed.
● Jianhu (phase-II) 12GW photovoltaic large silicon wafer project is under construction.
● Huaxian 5GW pv large silicon wafer project is in construction
● Yibin (Phase 1) 25GW photovoltaic large silicon wafer project
Slicing Base
Leshan Base: Leshan Gaoce New Energy Technology Co., Ltd.
Yancheng Base: Yancheng Gaoce New Energy Technology Co., Ltd.
Anyang Base: Anyang Gaoce New Energy Technology Co., Ltd.
Yibin Base: Yibin Gaoce New Energy Technology Co., Ltd.
Contact Us
Contact Us
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Qingdao Gaoce Technology Co., Ltd.
Tel: 86-532-87903188
Address: No. 66, Chongsheng Road, High Tech Industrial Development Zone, Qingdao, Shandong, China, 266114
Copyright © 2023 Qingdao Gaoce Technology Co., Ltd. SEO
Qingdao Gaoce Technology Co., Ltd.
Tel: 86-532-87903188
Address: No. 66, Chongsheng Road, High Tech Industrial Development Zone, Qingdao, Shandong, China, 266114
Copyright © 2022 Gaoce Technology SEO