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SolutionContact UsOur main business: R&D, production, sales, and supporting services for high hard brittle material cutting equipment, and cutting consumables.
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Product ShowContact UsOur main business: R&D, production, sales, and supporting services for high hard brittle material cutting equipment, and cutting consumables.
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Contact UsOur main business: R&D, production, sales, and supporting services for high hard brittle material cutting equipment, and cutting consumables. -
About Us
Contact UsOur main business: R&D, production, sales, and supporting services for high hard brittle material cutting equipment, and cutting consumables. -
Contact UsOur main business: R&D, production, sales, and supporting services for high hard brittle material cutting equipment, and cutting consumables.
SOLUTION
Silicon Wafer Cutting Service
Solution Profile
Solution Profile
Gaoce is the world’s largest professional silicon wafer processing service provider with the most comprehensive compatible specifications. By leveraging its technical closed-loop advantage in “cutting equipment, consumables, and processes,” the company offers silicon wafer cutting services and multi-specification wafers globally. Currently, its total planned capacity is 102GW, with 63GW operational across production bases in Yibin and Leshan (Sichuan Province) and Yancheng (Jiangsu Province). In 2024, the shipment volume of silicon wafers for silicon wafer slicing services was 37.5GW.
Gaoce continues to enhance its intelligent manufacturing capabilities by integrating cutting-edge technologies such as industrial internet, big data, digital twin, and generative AI with wafer manufacturing scenarios. This approach enables the creation of technologically advanced, highly automated, and cost-efficient production bases, combining technical leadership with cost advantages to help global silicon wafer enterprises reduce costs and improve efficiency.
Technology & Innovation
We mainly engage in large size silicon wafer and slicing, and implements the large-scale production for N-type 210 half-slice of 120μm. On Aug. 25, 2022, ultra-thin slice of 80μm was launched first in the industry. On May 12, 2023, the industry premiered 60 μM ultra-thin film.
Slicing Production Capacity
● Photovoltaic large silicon wafer R&D center and intelligent manufacturing demonstration base project have been completed.
● Leshan 20GW photovoltaic large silicon wafers and supporting projects (phase-I 6GW) has been completed.
● Jianhu (phase-I) 10GW photovoltaic large silicon wafer project has been completed.
● Jianhu (phase-II) 12GW photovoltaic large silicon wafer project is under construction.
● Yibin (Phase 1) 25GW photovoltaic large silicon wafer project
Slicing Base(completed and put into operation)
Leshan Slicing Base: Leshan Gaoce New Energy Technology Co., Ltd.
Yancheng Slicing Base: Yancheng Gaoce New Energy Technology Co., Ltd.
Yibin Slicing Base: Yibin Gaoce New Energy Technology Co., Ltd.
Contact Us
Contact Us
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Qingdao Gaoce Technology Co., Ltd.
Tel: 86-532-87903188
Address: No. 66, Chongsheng Road, High Tech Industrial Development Zone, Qingdao, Shandong, China, 266114
Copyright © 2023 Qingdao Gaoce Technology Co., Ltd. SEO
Qingdao Gaoce Technology Co., Ltd.
Tel: 86-532-87903188
Address: No. 66, Chongsheng Road, High Tech Industrial Development Zone, Qingdao, Shandong, China, 266114
Copyright © 2022 Gaoce Technology SEO