Special Diamond Wire for Semiconductor

Category:

Semiconductor Cutting Consumables

General description:

Special wire for semiconductor silicon with following advantages of high stability, high cutting efficiency and high strength, etc.
Due to the unique automatic control system, it can achieve smaller sand fluctuation, ensure the consistency of cutting products, uniform sand distribution, and high cutting efficiency; the production process runs under the monitoring of HD monitoring equipment, and can be traced; with special processing technology, the diamond wire is characterized with good toughness, high strength and good wear resistance.

Product Message

Product Parameter

Spec.& Model	Diameter of Finished Wire(μm)	Breaking force(N)	Purpose
45μm	62±3	≥9	Silicon semiconductor carbide slicing
65μm	77±3	≥15	Silicon semiconductor carbide slicing
70μm	80±3	≥17	Silicon semiconductor carbide slicing
70μm（12inch dedicated）	82±2	≥17	Silicon semiconductor carbide slicing
100μm	111±3	≥29	Silicon semiconductor carbide slicing