GC-SEDW812A

Semiconductor Diamond Wire Slicing Machine

Category:

Semiconductor Cutting Equipment

General description:

The is a special processing equipment where the diamond wire is used to cut semiconductor monocrystalline silicon and produce silicon wafers; it can process the silicon rods with diameter of 6 inches and 8 inches; the maximum processing length is 450mm (crystallographic orientation angle ≤1°). It is characterized with small silicon material loss, good processing quality, high cutting efficiency and good stability, etc.

Product Message

Product Parameter

S.N	Item	Unit	Content
1	Max. Workpiece Size	mm	Φ201×L450×1 (crystallographic orientation angle ≤1°)
2	Wire Feed Direction		One-way feeding/two-way feeding
3	Max. Wire Speed	m/min	1800
4	Cutting Method		Downwards cutting
5	Cutting Speed	mm/min	0~3
6	Fast Forward/Backward	mm/min	30~500
7	Max. Wire Reserve	km	50
8	Equipment Size (L×W×H)	mm	Approx. 5400×2100×3100
9	Equipment Weight	Kg	Approx. 14000