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  • GC-SEDW812A半导体金刚线切片机.jpg
  • 左面(8).jpg
  • 正面(10).jpg
  • 实景正面左侧面图(5).jpg
  • 实景背面右侧面图(2).jpg
  • 右面(6).jpg
  • 背面(6).jpg
  • 实景正面左侧面图.jpg

GC-SEDW812A

Semiconductor Diamond Wire Slicing Machine


Category:

Semiconductor Cutting Equipment

General description:

The is a special processing equipment where the diamond wire is used to cut semiconductor monocrystalline silicon and produce silicon wafers; it can process the silicon rods with diameter of 6 inches and 8 inches; the maximum processing length is 450mm (crystallographic orientation angle ≤1°). It is characterized with small silicon material loss, good processing quality, high cutting efficiency and good stability, etc.

Product Parameter

Relevant Products

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Single-wire Semiconductor Cutting Machine

GC-SELA812

Semiconductor Silicon Wafer Double-sides Grinding Machine

Special Diamond Wire for Semiconductor

Product Message