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GC-BD804

Semiconductor Chamfering Machine


Category:

Semiconductor Cutting

General description:

This product is suitable for edge chamfering processing equipment for semiconductor silicon wafer materials. The equipment is compatible with 4-inch, 6-inch, and 8-inch sizes and has OF-surface processing capabilities. A NOTCH groove processing function is optional. The equipment features high processing precision, high processing efficiency, and stable operation.

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