GC-BD804

Semiconductor Chamfering Machine

Category:

Semiconductor Cutting

General description:

This product is suitable for edge chamfering processing equipment for semiconductor silicon wafer materials. The equipment is compatible with 4-inch, 6-inch, and 8-inch sizes and has OF-surface processing capabilities. A NOTCH groove processing function is optional. The equipment features high processing precision, high processing efficiency, and stable operation.

Product Message

Product Parameter

Project	Parameters
Host Dimensions and Weight	2250(L)1650(W)2600(H)㎜；3000kg
Wafer Size	4, 6, 8 inches
Wafer Thickness	300μm—1500μm
Workstation	Dual Workstation
Wafer Reference Plane Shape	OF/Notch (Notch optional)
Equipment Dimensions	2250(W)1650(D)2600(H)
Grinding X/Y/Z Axis Accuracy	X, Y, Z Axis Accuracy: ±1μm
	Ceramic Chuck Plane Accuracy: ≤3μm
	Grinding Table Spindle End Face and Radial Accuracy: ±1μm
	Grinding Wheel Spindle End Face and Radial Accuracy: ±1μm
Grinding Wheel Outer Diameter	φ202mm
Grinding Wheel Inner Diameter	φ30mm
Grinding Wheel Thickness	20mm
Grinding Wheel Speed	0-4000r/min (selectable according to customer needs)
Notch Grinding Wheel Speed	0-100000r/min (selectable according to customer needs)
Grinding Wheel Groove Type	T, R, TT, RR, TR types, etc.
Wafer Thickness Measurement (Non-contact or contact type)	Thickness Measurement Repeatability Accuracy: ±2μm;
Wafer Thickness Measurement (Non-contact or contact type)	Number of Measurements: One point at the center
Cleaning Method	Rotary Cleaning
Drying Method	Centrifugal Drying
Loading/Unloading Section	Number of Boxes: 4 boxes
Loading/Unloading Section	Number of Slots: 25 slots (adjustable)