PRODUCT SHOW

GC-BD804
Semiconductor Chamfering Machine
Category:
Semiconductor Cutting
General description:
Product Parameter
Project |
Parameters |
Host Dimensions and Weight |
2250(L)*1650(W)*2600(H)㎜;3000kg |
Wafer Size |
4, 6, 8 inches |
Wafer Thickness |
300μm—1500μm |
Workstation |
Dual Workstation |
Wafer Reference Plane Shape |
OF/Notch (Notch optional) |
Equipment Dimensions |
2250(W)*1650(D)*2600(H) |
Grinding X/Y/Z Axis Accuracy |
X, Y, Z Axis Accuracy: ±1μm |
Ceramic Chuck Plane Accuracy: ≤3μm |
|
Grinding Table Spindle End Face and Radial Accuracy: ±1μm |
|
Grinding Wheel Spindle End Face and Radial Accuracy: ±1μm |
|
Grinding Wheel Outer Diameter |
φ202mm |
Grinding Wheel Inner Diameter |
φ30mm |
Grinding Wheel Thickness |
20mm |
Grinding Wheel Speed |
0-4000r/min (selectable according to customer needs) |
Notch Grinding Wheel Speed |
0-100000r/min (selectable according to customer needs) |
Grinding Wheel Groove Type |
T, R, TT, RR, TR types, etc. |
Wafer Thickness Measurement (Non-contact or contact type) |
Thickness Measurement Repeatability Accuracy: ±2μm; |
Number of Measurements: One point at the center |
|
Cleaning Method |
Rotary Cleaning |
Drying Method |
Centrifugal Drying |
Loading/Unloading Section |
Number of Boxes: 4 boxes |
Number of Slots: 25 slots (adjustable) |
Key word: Photovoltaic | Semiconductor | Silicon Carbide | Sapphire | Magnetic Materials | Silicon Wafer Cutting Service
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Qingdao Gaoce Technology Co., Ltd.

Tel: 86-532-87903188

Address: No. 66, Chongsheng Road, High Tech Industrial Development Zone, Qingdao, Shandong, China, 266114
Copyright © 2023 Qingdao Gaoce Technology Co., Ltd. SEO
Qingdao Gaoce Technology Co., Ltd.

Tel: 86-532-87903188

Address: No. 66, Chongsheng Road, High Tech Industrial Development Zone, Qingdao, Shandong, China, 266114
Copyright © 2022 Gaoce Technology SEO