GC-SEDW812

Semiconductor Diamond-Cutting-Line Slicer

Category:

Semiconductor Cutting Equipment

General description:

The product is a special processing equipment that USES diamond wire to cut semiconductor single crystal silicon sheet. It can process silicon rod diameter compatible with 8 、“12" and the maximum processing length 450mm (crystal deviation Angle ≤4°). It has the characteristics of small silicon material loss, good processing quality, high cutting efficiency and good stability.

Product Message

Product Parameter

Parameter
Max. Workpiece Size	mm	φ301xL450x1(crystal orientation declination≤4°)
Incoming direction	/	One-way incoming/two-way incoming
Max. wire Speed	m/min	2100
Cutting Method	/	Downwards cutting
Cutting Speed	mm/min	0~3
Fast Forward/rewing	mm/min	30~500
Max. Wire reserve	km	50
Equipment Size (LxW×H)	mm	About.6000×2600x3000
Equipment Weight	kg	About.14000