PRODUCT SHOW


Click to browse the large picture
+
  • 8.png

GC-SEDW812

Semiconductor Diamond-Cutting-Line Slicer


Category:

Semiconductor Cutting Equipment

General description:

The product is a special processing equipment that USES diamond wire to cut semiconductor single crystal silicon sheet. It can process silicon rod diameter compatible with 8 、“12" and the maximum processing length 450mm (crystal deviation Angle ≤4°). It has the characteristics of small silicon material loss, good processing quality, high cutting efficiency and good stability.

Product Parameter

Relevant Products

GC-SEWS824

Single-wire Semiconductor Cutting Machine

GC-SEDW812A

Semiconductor Diamond Wire Slicing Machine

GC-SELA812

Semiconductor Silicon Wafer Double-sides Grinding Machine

Special Diamond Wire for Semiconductor

Product Message