PRODUCT SHOW



Grinding Wheels for Cylindrical Grinding of Semiconductor Ingots
Category:
Semiconductor Cutting Consumables
General description:
t is mainly used in cylindrical grinding for semiconductor silicon rods of various specifications, and it has following features of high-speed and high-efficiency grinding, high processing precision, high material removal rate, and long service life.
Product Parameter
Code of Shape |
Conventional Specification |
|||
Outer Diameter, D |
Thickness, T |
Aperture, H |
Particle Size |
|
1A1 |
350 |
35~100 |
127 |
100#~600# |
400 |
50~150 |
203 |
Key word: Photovoltaic | Semiconductor | Silicon Carbide | Sapphire | Magnetic Materials | Silicon Wafer Cutting Service
Relevant Products
Product Message
Qingdao Gaoce Technology Co., Ltd.

Tel: 86-532-87903188

Address: No. 66, Chongsheng Road, High Tech Industrial Development Zone, Qingdao, Shandong, China, 266114
Copyright © 2023 Qingdao Gaoce Technology Co., Ltd. SEO
Qingdao Gaoce Technology Co., Ltd.

Tel: 86-532-87903188

Address: No. 66, Chongsheng Road, High Tech Industrial Development Zone, Qingdao, Shandong, China, 266114
Copyright © 2022 Gaoce Technology SEO