GC-800X

Crystal Silicon Diamond Wire Saw

Category:

Photovoltaic Cutting Equipment

General description:

Launched in 2023,this product is used in the slicing process of silicon wafer manufacturing. The product adopts a brand new platformized design and industry-leadingadjustable small wheelbase design, which can be compatible with the cutting needs ofdifferent sizes of silicon wafers such as 16X/18X/210/220/230/.lt is also compatible withthe development needs of large-sized, thin, half wafer, and rectangular wafers for newbatteries such as HJT and TOPCon. The product adopts a brand new cutting area layout,with a maximum silicon rod loading capacity of 950mm long; lt is equipped with newhigh-precision oil and gas bearing boxes, more advanced tension control algorithms.high-precision sensors for wire arrangement, achieving higher precision control of tension, stronger overall stability, and higher cutting efficiency; stronger adaptability withthinner wireand thinner wafers with more convenient operation. Meanwhile, multipleautomation interfaces are reserved, which can utilize big data platforms to achieveintelligent production operations and refined production management.

Product Message

Product Parameter

Size of silicon rod	□166~□230×LMax.950mm(compatible with half wafer)
Wheelbase	315~415mm(compatible and adjustable)
Wire reserve	240km
Equipment Size	Approx.5780×2030×3538mm
Equipment Weight	About 16500kg