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Solution

Solution
• Photovoltaic Cutting Solutions

• Semiconductor Cutting Solutions

• Silicon Carbide Cutting Solutions

• Magnetic Materials Cutting Solutions

• Sapphire Cutting Solutions

• Silicon Wafer Cutting Service

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Globalization
Our main business: R&D, production, sales, and supporting services for high hard brittle material cutting equipment, and cutting consumables.

Product Show

Product Show
• Photovoltaic Cutting Equipment/Consumables

• Semiconductor Cutting Equipment/Consumables

• Silicon Carbide Cutting Equipment/Consumables

• Sapphire Cutting Equipment/Consumables

• Magnetic Materials Cutting Equipment/Consumables

• Silicon Wafer
• GC-MJ706R/908R Ring-wire Cutter

• GC-MK202R Monocrystal Squarer Machine

• GC-GP950L Grinding and Polishing Machine

• GC-MM850M Grinding and Polishing Machine

• GC-MK202RG integrated grinding Machine

• GC-MM1000M Cutting and Grinding Integrated Machine

• GC-800XPCrystal Silicon Diamond Wire Saw

• GC-800XCrystal Siicon Diamond Wire Saw

• Diamond Wire

• Annular Diamond Wire

• Diamond Grinding Tools
• GC-SEDW812 Semiconductor Diamond-Cutting-Line Slicer

• GC-SEWS824 Single-wire Semiconductor Cutting Machine

• GC-SEDW812A Semiconductor Diamond Wire Slicing Machine

• GC-SELA812 Semiconductor Silicon Wafer Double-sides Grinding Machine

• Special Diamond Wire for Semiconductor

• Grinding Wheels for Chamfering & Grinding of Semiconductor Wafer

• Grinding Wheels for Cylindrical Grinding of Semiconductor Ingots

• Semiconductor Thinning Grinding Wheel
• GC-SCDW8300 Silicon Carbide Wafering Machine

• GC-SCDW6500 Silicon Carbide Slicing Machine

• Silicon Carbide Thinning Grinding Wheel

• Grinding Wheels For Silicon Carbide

• Special Diamond Wire for Silicon Carbide
• GC-SADW6670 Sapphire Slicing Machine

• GC-QT-803 Single-wire Quartz Slicing Machine

• Special Sapphire Thinning Grinding Wheel

• Special Diamond Wire for Sapphire

• Special Chamfering & Grinding Wheel
• GC-MADW1660 Multi-wire Magnetic Thin-sheet Slicing Machine

• GC-MAWS210 Single-wire Magnetic Material Slicing

• GC-MADW1280R Magnetic Thick-sheet & Tile Multi-wire

• GC-MADW1880 Magnetic Thick-sheet & Straight-sheet Multi-wire Slicing Machine

• Magnetic Material Cutting Wire
• Silicon Wafer
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Globalization
Our main business: R&D, production, sales, and supporting services for high hard brittle material cutting equipment, and cutting consumables.

News

News
• Company Dynamics

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Globalization
Our main business: R&D, production, sales, and supporting services for high hard brittle material cutting equipment, and cutting consumables.

About Us

About Us
• Company Profile

• Driven by Science and Technology

• Our Customers

• Honors and Recognition

• Corporate Culture

• History

• Globalization

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Globalization
Our main business: R&D, production, sales, and supporting services for high hard brittle material cutting equipment, and cutting consumables.

Investor

Investor
• Company Announcement

• Investor Education

• Investor Interaction

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Globalization
Our main business: R&D, production, sales, and supporting services for high hard brittle material cutting equipment, and cutting consumables.

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