GC-SELA812

Semiconductor Silicon Wafer Double-sides Grinding Machine

Category:

Semiconductor Cutting Equipment

General description:

This equipment is used in double-sides grinding for semiconductor silicon wafers. 35 pieces of 8-inches silicon wafers or 15 pieces of 12-inches silicon wafers can be placed in one plate. With the hydrostatic rotary table, it is characterized with following advantages like strong bearing capacity, small power loss and long service life, etc.; in addition, its lubricating medium can play roles of vibration damping and error averaging with high precision and good precision assurance.

Product Message

Product Parameter

1.Mechanical Part
Equipment Body Size			Approx. 3200(L)x2950(W)x4250(H)mm
Equipment Footprint			Approx. 6000(L)x5500(W)mm
Equipment Weight			Approx. 28000kg
2.Specification, Quantity and Precision of Processed Silicon Wafers
Size of Silicon Wafer			8 inches and 12 inches
Qty.	8 inches		35pieces/ plate
	12 inches		15pieces/ plate
3.Technical Parameters
Lower Plate		Size of Lower Plate	Φ1870mm×Φ650mm×70mm
		RPM of Lower Plate	3-40RPM
Upper Plate		Size of Upper Plate	Φ1870mm×Φ650mm×60mm
		RPM of Upper Plate	3-13RPM
Sun Gear		Rotating Speed	3-30RPM
Outer Gear		Rotating Speed	3-30RPM 3-30RPM
Lifting Stroke of Upper Plate			550mm
4.Air Source
Required Compressed Air			Dry air
Required Air Pressure for Air circuit Components (MPa)			0.4~0.6