Single-wire Semiconductor Cutting Machine
Semiconductor Cutting Equipment
This is a special processing equipment for cutting semiconductor monocrystalline silicon rod. The diameter of silicon rod that can be processed is 8-24 inches, and the maximum processing length is 2600mm. The equipment adopts diamond wire cutting, which can realize the functions of cropping, head/tail removal and sample cutting, etc. with the features of high cutting efficiency and good section quality.