GC-SCDW8300

Silicon Carbide Wafering Machine

Category:

Silicon Carbide Cutting Equipment

General description:

This product is a special processing equipment that adopts the diamond wire for cutting semiconductor silicon carbide wafers, it can process crystal rod of various diameters, compatible with 6 inches and 8 inches, and the maximum processing length is 300mm. It has following features, small material loss, good processing quality, high cutting efficiency, good stability, etc.

Product Message

Product Parameter

S.N.	Project	Unit	Content
1	Max workpiece size	mm	6～8”×L300
2	Incoming direction		One-way incoming/two-way incoming
3	Max linear speed	m/min	3000
4	Cutting method		Downwards cutting
5	Cutting speed	mm/min
6	Fast forward/rewind	mm/min	50～500
7	Max. swing angle	°	±10
8	Max. wire reserve	Km	120
9	Equipment size (LWH)	mm	About 4880×2100×3100
10	Equipment Weight	Kg	About 14000