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  • 半导体解决方案GC-SEDW812.jpg
  • 背面(4).jpg
  • 实景正面左侧面图(3).jpg
  • 实景背面右侧面图.jpg
  • 右面(4).jpg
  • 实景正面右侧面图(4).jpg
  • 正面(8).jpg
  • 左面(6).jpg

GC-SADW6670

Sapphire Slicing Machine


Category:

Sapphire Cutting Equipment

General description:

The equipment is used for sapphire slicing. The front side is used for materials loading and unloading, the left and right sides are used for wire arrangement, the width of whole machine is ≤2m, and the site utilization can be maximized. The servo motor will drive the tension rocker to ensure the sensitivity of tension regulation; via adjusting the structure design for key components, the following cutting requirements can be met, maximum 50N cutting tension, 2400m/min wire speed and 700mm rod length.

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