Semiconductor Cutting Solutions
In 2018, depending on its independent core capability, Gaoce company had formally introduced the diamond wire cutting technology into cutting of semiconductor silicon material. For the processing of semiconductor single crystal silicon wafer, the company had launched 8-inch and 12-inch semiconductor diamond wire slicers, at the same time, developed special diamond wire and chamfer grinding wheel for slicing of semiconductor silicon material. At present, we have formed continuous and stable cooperation with leading customers in the industry.
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