GC-SEDW812

Semiconductor Diamond-Cutting-Line Slicer

Category:

Semiconductor Cutting Equipment

General description:

The product is a special processing equipment that USES diamond wire to cut semiconductor single crystal silicon sheet. It can process silicon rod diameter compatible with 8 、“12" and the maximum processing length 450mm (crystal deviation Angle ≤4°). It has the characteristics of small silicon material loss, good processing quality, high cutting efficiency and good stability.

Product Message

Product Parameter

S.N.	Project	Unit	Content
1	Max workpiece size	mm	Φ301×L450×1个（crystal orientation declination ≤4°）
2	Incoming direction		One way incoming.two way incoming
3	Max linear speed	m/min	2100
4	Cutting method		Downwards cutting
5	Cutting speed	mm/min	0~3
6	Fast forward/rewind	mm/min	30~300
7	Max. wire reserve	km	50
8	Equipment size (LWH)	mm	About 5400×2200×3000
9	Equipment Weight	Kg	About 14000