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Special Diamond Wire for Semiconductor


Semiconductor Cutting Consumables

General description:

Special wire for semiconductor silicon with following advantages of high stability, high cutting efficiency and high strength, etc.
Due to the unique automatic control system, it can achieve smaller sand fluctuation, ensure the consistency of cutting products, uniform sand distribution, and high cutting efficiency; the production process runs under the monitoring of HD monitoring equipment, and can be traced; with special processing technology, the diamond wire is characterized with good toughness, high strength and good wear resistance.

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