GC-MADW 1660

Magnetic Thick Slice Multi-wire Cutter

Category:

Magnetic Materials Cutting Equipment

General description:

This is specialized equipment to cut magnetic materials into wafers using wire. It was launched in 2023 and adopts modular and platform design, allowing for dual station operation; independently developed high-precision bearing box, and the maximum cutting speed can reach 2600m/min; advanced tension control algorithm, with tension control accuracy ≤0.5N; thinner wire cutting, lower kerf loss, maximized yield; direct-driven core cutting spindle and take-up and pay-off roller, stable operation; intelligent design, reserved open software interface, meeting the requirements of big data information integration in factories, to achieve intelligent production and refined production control. It is a new type of equipment with reliable functions and higher processing accuracy.

Product Message

Product Parameter

Max. processing size	mm	Straight wafer (WxLxH): 160x600x160
Slice thickness	mm	1.5~30
Max. wire speed	m/min	Max. 2600
Cutting method		Vertical upward feed/cutting
Cutting speed	mm/min	0.1~9
Max. wire reserve (Standard PV600DT I-shaped wheel)	km	30 (0.20 wire) 50 (0.10 wire)
Max. tension	N	35 (high-precision tension control, tension fluctuation ≤0.5N)
Dimensions (L×W×H)	mm	Approx. 3000×1800×2900
Total weight	T	Approx. 10
Air consumption	L/min	Water-based cutting fluid, with air consumption of approx. 600L/min
Noise during no-load operation	dB(A)	≤80 (Test conditions: 2100m/min wire speed, at the front control panel, 1m away from the equipment and ground)