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GC-MADW 1660

Magnetic Thick Slice Multi-wire Cutter


Magnetic Materials Cutting Equipment

General description:

This is specialized equipment to cut magnetic materials into wafers using wire. It was launched in 2023 and adopts modular and platform design, allowing for dual station operation; independently developed high-precision bearing box, and the maximum cutting speed can reach 2600m/min; advanced tension control algorithm, with tension control accuracy ≤0.5N; thinner wire cutting, lower kerf loss, maximized yield; direct-driven core cutting spindle and take-up and pay-off roller, stable operation; intelligent design, reserved open software interface, meeting the requirements of big data information integration in factories, to achieve intelligent production and refined production control. It is a new type of equipment with reliable functions and higher processing accuracy.

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