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  • 半导体滚圆砂轮.jpg
  • 半导体滚圆砂轮2.jpg
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Grinding Wheels for Cylindrical Grinding of Semiconductor Ingots


Category:

Semiconductor Cutting Consumables

General description:

t is mainly used in cylindrical grinding for semiconductor silicon rods of various specifications, and it has following features of high-speed and high-efficiency grinding, high processing precision, high material removal rate, and long service life.

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