Gaoce Technology_Cutting equipment,Cutting consumables

Photovoltaic Cutting Solutions

Full Coverage of Core Processes in Silicon Wafer Manufacturing

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Gaoce Inc.

To Become a World Leading Equipment & Service Provider for Hard Brittle Materials Cutting

Qingdao Gaoce Technology Co., Ltd. was established in October 2006. On August 7, 2020, it was listed on the A-share of Science and Technology Innovation Board (stock code: 688556). The headquarters of Gaoce Company is located in the High-tech Industrial Development Zone of Qingdao China with following wholly-owned subsidiaries, Changzhi Gaoce New Material Technology Co., Ltd., Huguan Gaoce New Material Technology Co., Ltd., Luoyang Gaoce Precision Machinery Co., Ltd., Leshan Gaoce New Energy Technology Co., Ltd., Yancheng Gaoce New Energy Technology Co., Ltd., and Yibin Gaoce New Energy Technology Co., Ltd.

2006 Established

Gaoce Company was established in October 2006.

6.184 billion yuan

Operating revenue of 6.184 billion yuan (data as of December 31, 2023)

5228 People

Number of staff: 5228

(Data by Dec. 31, 2023)

Industry Solutions

Our Products

Grinding and Polishing Machine

Crystal Silicon Diamond Wire Saw

Monocrystal Squarer Machine

Single-wire Semiconductor Cutting Machine

Semiconductor Silicon Wafer Double-sides Grinding Machine

GC-GP950L

Grinding and Polishing Machine

This product is designed for grinding, polishing, and chamfering in silicon rod manufacturing. The core component is made of an integral casting to ensure high machining accuracy and reliability. The high-strength, high-speed spindle and high-power motor improve machining efficiency. Switch machining of M10, G12, and rectangular rods with just one click. The optional feeding platform with intelligent adjustment helps reduce silicon loss.

GC-800X

Crystal Silicon Diamond Wire Saw

Launched in 2023,this product is used in the slicing process of silicon wafer manufacturing. The product adopts a brand new platformized design and industry-leadingadjustable small wheelbase design, which can be compatible with the cutting needs ofdifferent sizes of silicon wafers such as 16X/18X/210/220/230/.lt is also compatible withthe development needs of large-sized, thin, half wafer, and rectangular wafers for newbatteries such as HJT and TOPCon. The product adopts a brand new cutting area layout,with a maximum silicon rod loading capacity of 950mm long; lt is equipped with newhigh-precision oil and gas bearing boxes, more advanced tension control algorithms.high-precision sensors for wire arrangement, achieving higher precision control of tension, stronger overall stability, and higher cutting efficiency; stronger adaptability withthinner wireand thinner wafers with more convenient operation. Meanwhile, multipleautomation interfaces are reserved, which can utilize big data platforms to achieveintelligent production operations and refined production management.

GC-800XP

Crystal Silicon Diamond Wire Saw

With the world's first single machine dual station and adjustable wheelbase design, this equipment is playing a significant role in the slicing process of silicon wafer manufacturing. It is compatible with the cutting needs of different sizes of silicon wafers such as16X/18X/210/220/230/240, as well as the development needs of new batteries such as HJT and TOPCon for large-sized, thinned, half wafers, and rectangular wafers. Equipped with eccentric sleeve/eccentric bearing box technology, latest cutting layout, one-piece casting frame and more reliable components, this equipment can achieve a higher stability. It adopts independently developed software and tension control algorithms, reserves MES/automation interfaces, and integrates big data platform to realize intelligent production operations and fine production control. Compared to single station equipment, the footprint per GW can be reduced by 25+%, and labor cost of principal oper- ators by 30+%, which will continuously create value for clients.

GC-MK202R

Monocrystal Squarer Machine

This product is designed for square during manufacturing of silicon wafer, launched in 2022, independent circle wire dual station machining, small range, silicon loss 10% lower than that of diamond wire products; no edge chipping, complete edge without damage, automatic delivery. There is no ribbed strip when machining G12 products; switch via one click to machine M10, G12 and rectangle rods, easy operation, convenient maintenance, and the user can get to know how to operate the equipment quickly; optional cutting of half rods, high scalability.

GC-SEWS824

Single-wire Semiconductor Cutting Machine

This is a special processing equipment for cutting semiconductor monocrystalline silicon rod. The diameter of silicon rod that can be processed is 8-24 inches, and the maximum processing length is 2600mm. The equipment adopts diamond wire cutting, which can realize the functions of cropping, head/tail removal and sample cutting, etc. with the features of high cutting efficiency and good section quality.

GC-SELA812

Semiconductor Silicon Wafer Double-sides Grinding Machine

This equipment is used in double-sides grinding for semiconductor silicon wafers. 35 pieces of 8-inches silicon wafers or 15 pieces of 12-inches silicon wafers can be placed in one plate. With the hydrostatic rotary table, it is characterized with following advantages like strong bearing capacity, small power loss and long service life, etc.; in addition, its lubricating medium can play roles of vibration damping and error averaging with high precision and good precision assurance.

Driven by Science and Technology

725 valid patents

44 software copyrights

Data by Dec. 31, 2023

Photovoltaic Equipment

01.

Photovoltaic monocrystal half-chip production line

It is the first cutting production line for half-chips, where, multiple processes have been adopted to achieve large-scale production of half-chips, including squaring, middle splitting, half-rod grinding, and half-chip cutting; it is the leading half-chips cutting technology in the industry.

Squarer Machine

02.

Double-station loop-wire squaring technology

It is the first double-brick vertical loop-wire squaring equipment, where, the non-destructive structure for wings collection is for the first time developed and applied, and the processing of half-brick as well as the rectangular brick can be compatible.

Grinding and Polishing Machine

03.

Composite grinding spindle technology

For the first time the coarse & fine grinding at same station is developed, which can reduce the fine grinding allowance, improve the machining accuracy and efficiency, and increase the service life of grinding wheel.

Slicing Machine

04.

Adjustable wheelbase technology

Solve the compatibility problem in cutting mainstream silicon wafers of different sizes in the market; Minimize the distance between silicon rod and cutting point of diamond wire on main roller, and improve the cutting efficiency and wafer quality; It is suitable for half-piece cutting with ultra-small wheelbase, and provides technical support for the rapid development of new batteries.

Diamond Wire

05.

12-wire production equipment for electroplated diamond wires

Gaoce is the first company to develop 12-wire diamond wire production equipment.

Diamond Wire

06.

Sandblasting technology for electroplated diamond wires

Fast sandblasting on core steel wire, good sand fixing performance.

Diamond Wire

07.

Iteration technology for thinning of electroplated diamond wires

34μm electroplated diamond wires have been supplied in bulk, the electroplated diamond wire of less than 28μm is in R&D process continuously, and the thinning iteration technology is in the front of the industry.

Semiconductor Slicing Machine

08.

Ultra-precision processing technology for the third-generation semiconductor monocrystal silicon carbide and large size monocrystal silicon

Semiconductor slicing machine: accelerate the substitution of domestic slicing equipment, continue the fine wire cutting, reduce cost, improve efficiency, decrease pollution, improve environmental protection, and guide the technological revolution in the industry.

Globalization

500 +

500 R&D staff

7 manufacturing bases

150 +

150+ sales and after-sales staff

Our Customers

Photovoltaic Semiconductors Silicon Carbide Magnetic Materials Sapphire Silicon Wafer Slicing Service

News Center

2022/12/29

The publicity film of Gaobeta Joint Stock Company was launched at the end of the year!

2022/12/27

Continuous steady growth, net profit expected to increase by 370%!

On December 26, Gaoshi Shares released the Voluntary Disclosure Announcement on the Anticipated Increase of Annual Performance in 2022. The company expects to realize a net profit attributable to the owners of the parent company of 760 million yuan to 820 million yuan in 2022, which is expected to increase by 587307900 yuan to 647307900 yuan, 340.09% to 374.83% year on year, compared with the same period last year (statutory disclosure data).

2022/12/26

Chen Kundi, the watcher: Be cautious as always with his deeds and words

This is the first time that the Guardian has connected across the ocean. Chen Kundi, the customer service person of Gaosu, is at the customer's site in Vietnam to calibrate the wire spacing of the slicer. In order not to delay the production of the production line, after finishing the work at hand, he came to the canteen for this interview.