Qingdao Gaoce Technology Co., Ltd.
Qingdao Gaoce Technology Co., Ltd.

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GC-GP950L

Grinding and Polishing Machine

Category:

Photovoltaic Cutting Equipment

General description:

This product is designed for grinding, polishing and chamfering of silicon wafers, adopting high-strength high-precision spindles with maximum speed of 4000r/min, high capacity; fully automated control, automatic detection and loading, adaptive adjustment, and automatically call up corresponding formula for processing and also support higher performance extension.
Product Message

Product Parameter

Machining margin, diameter, chamfer tolerance

±0.05mm
Angles between any adjacent surfaces

0.05°
Roughness

Four sided Ras0.1um, arc Ras0.2µm
Processing efficiency (M10, 830mm)

35min

Key word: Photovoltaic | Semiconductor | Silicon Carbide | Sapphire | Magnetic Materials | Silicon Wafer Cutting Service

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Product Message

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Qingdao Gaoce Technology Co., Ltd.

联系电话

Tel: 86-532-87903188

公司地址

Address: No. 66, Chongsheng Road, High Tech Industrial Development Zone, Qingdao, Shandong, China, 266114

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