GC-SCDW6500

Silicon Carbide Slicing Machine

Category:

Silicon Carbide Cutting Equipment

General description:

This is a special processing equipment, where, the diamond wire is used to cut semiconductor silicon carbide and produce wafers. It can process crystal rods with diameter of 4 inches and 6 inches; the maximum processing length is 300mm. It is characterized with small material loss, good processing quality, high cutting efficiency and good stability.

Product Message

Product Parameter

S.N.	Item	Unit	Content
1	Max. Workpiece Size	mm	4～6”×L400
2	Wire Feeding Direction		One-way feeding/two-way feeding
3	Max. Wire Speed	m/min	2400
4	Axle Base	mm	395
5	Number of Main Rollers	bar	2
6	Outer Diameter of Main Roller Slot	mm	Range: Φ192～Φ202
7	Wire Consumption	mm	≤0.23
8	Cutting Tension	N	10～50
9	Cutting Method		Downwards cutting
10	Fast Forward/Backward	mm/min	50～500
11	Max. Swing Angle	°	±12
12	Max. Swing Speed	°/s	12
13	Max. Wire Reserve	Km	60 (Model 0.2 wire)
14	Dimension (L x W x H)	mm	Approx. 4300×2000×3100
15	Equipment Weight	Kg	Approx. 12000