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GC - GP950L

Grinding and Polishing Machine


Category:

Photovoltaic Cutting Equipment

General description:

This product is designed for grinding, polishing and chamfering of silicon wafers, adopting high-strength high-precision spindles with maximum speed of 4000r/min, high capacity; fully automated control, automatic detection and loading, adaptive adjustment, and automatically call up corresponding formula for processing and also support higher performance extension.

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