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GC-MADW1880
Magnetic Thick-sheet & Straight-sheet Multi-wire Slicing Machine
Category:
Magnetic Materials Cutting Equipment
General description:
Product Parameter
S.N. |
Item |
Unit |
Content |
1 |
Max. Processing Size |
mm |
180 (W) x 800 (L) x 150 (H) x double stations |
2 |
Wafer Thickness |
mm |
1.5~20 |
3 |
Max. Wire Speed |
m/min |
Max. 2000, stable cutting at 1800 |
4 |
Cutting Method |
|
Vertical upward feed/cutting |
5 |
Cutting Speed |
mm/min |
0.1~9 |
6 |
Max. Wire Reserve |
km |
30(0.20 Diamond wire); 50 (0.12 Diamond wire); |
7 |
Dimensions (L×W×H) |
mm |
Approx. 3500×2150×3000 |
8 |
Equipment Weight |
ton |
Approx. 10 |
9 |
No-load Running Noise |
dB(A) |
≤80 (Test conditions: measure at the front panel 1m away from the equipment and 1m off the ground at 1800m/min wire speed) |
Key word: Photovoltaic | Semiconductor | Silicon Carbide | Sapphire | Magnetic Materials | Silicon Wafer Cutting Service
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Product Message
Qingdao Gaoce Technology Co., Ltd.

Tel: 86-532-87903188

Address: No. 66, Chongsheng Road, High Tech Industrial Development Zone, Qingdao, Shandong, China, 266114
Copyright © 2023 Qingdao Gaoce Technology Co., Ltd. SEO
Qingdao Gaoce Technology Co., Ltd.

Tel: 86-532-87903188

Address: No. 66, Chongsheng Road, High Tech Industrial Development Zone, Qingdao, Shandong, China, 266114
Copyright © 2022 Gaoce Technology SEO