PRODUCT SHOW


Click to browse the large picture
Click to browse the large picture
Click to browse the large picture
Click to browse the large picture
Click to browse the large picture
Click to browse the large picture
Click to browse the large picture
Click to browse the large picture
Click to browse the large picture
+
  • 4(5).jpg
  • 实景正面右侧面图(5).jpg
  • 右面(5).jpg
  • 实景背面右侧面图(1).jpg
  • 实景正面左侧面图(4).jpg
  • 背面(5).jpg
  • 左面(7).jpg
  • 正面(9).jpg
  • GC-SCDW6500型碳化硅切片机.jpg

GC-SCDW6500

Silicon Carbide Slicing Machine


Category:

Silicon Carbide Cutting Equipment

General description:

This is a special processing equipment, where, the diamond wire is used to cut semiconductor silicon carbide and produce wafers. It can process crystal rods with diameter of 4 inches and 6 inches; the maximum processing length is 300mm. It is characterized with small material loss, good processing quality, high cutting efficiency and good stability.

Product Parameter

Relevant Products

undefined

undefined

Contact Us

Contact Us


*Note: be sure the information is filled accurately and the communication is clear, and we will get in touch with you as soon as possible